发明名称 SILICON SUBSTRATE AND ITS FORMATION
摘要 PROBLEM TO BE SOLVED: To provide a silicon substrate controlled in the porosity, pore diameter, distribution width of the pore diameter in the porous silicon region and the shape of the porous silicon and a method for formation thereof relating to the silicon substrate selectively having the porous silicon within the substrate and a method for formation thereof. SOLUTION: This method for formation of the silicon consists in covering the silicon substrate 1 with a partly opened mask layer 3, immersing the substrate into a chemical conversion liquid and impressing chemical conversion current thereon and anodically chemical converting a part of the silicon substrate 1 from the removed part of this mask layer 3, thereby forming the porous silicon 10 to 11 to a band form within the silicon substrate. The chemical conversion current described above is increased according to the growth degree of the porous silicon in such a manner that the current density at the boundary between the front end of the growth of the porous silicon and the silicon substrate 1 in the process of the anodically chemical conversion is made nearly constant.
申请公布号 JPH11242125(A) 申请公布日期 1999.09.07
申请号 JP19980157525 申请日期 1998.06.05
申请人 KYOCERA CORP 发明人 NAGATA SEIICHI
分类号 G02B6/122;G02B6/13;H01L21/3063;(IPC1-7):G02B6/122 主分类号 G02B6/122
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