Multi-chip module, an electronic device, and production method thereof

摘要

A substantially lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having a substantially lead-free electrode is face-down mounted on the first surface. A substantially lead-free bump is formed on the substantially lead-free electrode of an electronic element. Mounting pads and substantially lead-free bumps are electrically and mechanically connected to each other by substantially lead-free conductive resin. A substantially lead-free sealing pattern is formed at the area which encloses the electronic element mounted area, of the first surface of the substrate. A weld ring made of Kovar is brazed onto the sealing pattern with substantially lead-free solder. The opening edge of a sealing cap made of Kovar disposed opposite to the weld ring and the weld ring are bonded at the deposited zone by welding.