发明名称 SAMPLING METHOD OF ANALYZING SAMPLE IN ELECTROLYTIC COPPER PLATE
摘要 PROBLEM TO BE SOLVED: To provide a sampling method of an analyzing sample without rendering electrolytic copper plate scrap after sampling. SOLUTION: Each electrolytic copper plate 1 is vertically and horizontally divided into N pieces to form 2N vertical and horizontal rectangular areas 2 in total. With respect to each rectangular area 2, a linear collecting area 3 for connecting a base end point 20 in the lateral center to the longitudinal terminal point is set, and with respect to each of N electrolytic copper plates 1, two each of vertical and horizontal collecting areas 3 and a sawing area 4 satisfying the following conditions and formed of the base end point or terminal point of the collecting area and a middle point 21 are selected, each selected sawing area 4 is sawed, and its chip is collected and applied as an analyzing sample. The conditions are: two each of vertical and horizontal sawing areas 4 within the electrolytic copper plate 1 are never mutually crossed (conditionα), and all two each of vertical and horizontal sawing areas 4 in the electrolytic copper plate 1 are never mutually superposed, and the whole collecting area of the rectangular areas 2 is formed by combining all the two each of vertical and horizontal sawing areas 4 (conditionβ).
申请公布号 JPH11241978(A) 申请公布日期 1999.09.07
申请号 JP19980060456 申请日期 1998.02.25
申请人 SUMITOMO METAL MINING CO LTD 发明人 WATANABE KATSUAKI
分类号 G01N1/04;B23H3/00;(IPC1-7):G01N1/04 主分类号 G01N1/04
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