| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of the microwave circuit board, which is superior in connectivity by wire bonding and can be patterned finely. SOLUTION: After the injection molding of resin, an electric circuit pattern 20 is formed on the resin, and wire bonding to the electric circuit pattern 20 is carried out to manufacture the microscope circuit board. A metal frame 15 is inserted into a metal mold, resin molding is performed so as to form a pad part 21 by exposing a position on the metal frame 15 to be bonded, and then the electric circuit pattern 20 is so formed that it is electrically connected to the pad part 21.</p> |
