| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin compsn. which gives high adhesion strength when a conductive layer is formed by plating on a resin layer, to provide a photosensitive resin compsn. which can form an insulating layer having excellent heat resistance, moisture- resistant reliability and adhesion strength for a multilayered printed circuit board, especially a buildup multilayered printed circuit board, and to provide a multilayered printed circuit board having excellent adhesion strength and its producing method. SOLUTION: This photosensitive resin compsn. contains an org. filler and a photopolymn. initiator as essential components in an alkali-soluble resin matrix. At least a part of the alkali-soluble resin consists of an alkali-soluble resin having a fluorene structure, and the amt. of the org. filter is 10 to 100 pts.wt. to 100 pts.wt. of the alkali-soluble resin. The average particle size and coefft. of variation of the org. filler are 5 to 20μm and <=50%, respectively. The multilayered printed circuit board has an insulating layer formed by hardening the photosensitive resin compsn. above described. When the multilayered printed circuit board is produced by a buildup method using the photosensitive resin compsn., annealing after plating is carried out under more severe conditions than the conditions of post-curing of the resin. |
