发明名称 |
Diffusion bonding of lead interconnections using precise laser-thermosonic energy |
摘要 |
Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.
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申请公布号 |
US5948286(A) |
申请公布日期 |
1999.09.07 |
申请号 |
US19970796767 |
申请日期 |
1997.02.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHALCO, PEDRO A.;HORTON, RAYMOND ROBERT;NARAYAN, CHANDRASEKHAR;PALMER, MICHAEL JON |
分类号 |
B23K26/06;H01L21/48;H05K3/32;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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