| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide electronic equipment which is capable of effectively cooling down a CPU. SOLUTION: The electronic equipment is equipped with heat pipes 1 which cool down a CPU 5, the heat absorbing part 2 of the heat pipes 1 is arranged adjacent to the CPU 5, whereby a transfer of heat from the CPU 5 to the heat absorbing part 21 is improved in efficiency. The heat dissipating parts 4 of the heat pipes 1 are arranged on a heat sink 6 separating from each other, so that the CPU 5 can be surely cooled down adequately by one of the heat dissipating parts 4, even when the other heat dissipating part 4 deteriorates in heat dispersion efficiency. Furthermore, fins 7 are attached to the heat pipes 1, whereby the heat dissipating parts 4 can be improved in cooling efficiency.</p> |
