发明名称 PRODUCTION OF FLAKY COPPER POWDER FOR CONDUCTIVE COATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a flaky copper powder for a conductive coating material, which can cope with processing techniques such as ones for forming thin films or fine patterns by coating a flaky copper powder having a specified particle diameter and a specified specific surface area with a fatty acid and subjecting the coated powder to a reduction treatment in a reducing atmosphere. SOLUTION: This powder is obtained by mixing and coating a flaky copper powder having a particle diameter of 100μm or below and a BET specific surface area of 3,000 cm<2> /g or above with 0.1 wt.%, or above fatty acid and subjecting the coated powder to a reduction treatment at a temperature of 200-500 deg.C in a reducing atmosphere. The flaky copper powder as the starting material is any mechanically flaked copper powder and is exemplified by an atomized copper powder or one prepared by grinding an electrolytic copper powder with a grinder such as a ball mill. The mixing and coating with a fatty acid can be suitably performed by mechanically mixing them with a ball mill or a mixer. The fatty acid is desirably a higher fatty acid such as lauric acid, palmitic acid, or stearic acid. The reducing atmosphere used is hydrogen, carbon monoxide, a natural gas, or the like.
申请公布号 JPH11241035(A) 申请公布日期 1999.09.07
申请号 JP19980045021 申请日期 1998.02.26
申请人 FUKUDA METAL FOIL & POWDER CO LTD 发明人 KAJITA OSAMU;NISHIDA MOTONORI;NOCHIDA KOJI;YOSHITAKE MASAYOSHI
分类号 C09C1/66;B22F1/02;C09D5/24;(IPC1-7):C09C1/66 主分类号 C09C1/66
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