| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce thermal stress from a heat sink applied to an insulating plate.SOLUTION: A semiconductor device of the present embodiment has a composition in which a semiconductor element and a heat dissipation block bonded to one principal surface of the semiconductor element are encapsulated by a resin member. The heat dissipation block has a constitution in which a heat sink, a first metal plate, an insulating plate and a second metal plate are bonded from the semiconductor element side, and a linear expansion coefficient of the first metal plate is smaller than a linear expansion coefficient of the heat sink.SELECTED DRAWING: Figure 1 |
