发明名称 Fremgangsmåte og anordning for å beskytte et mönsterkort mot overström
摘要 In order to reduce the costs of assembled printed circuit boards, a printed board fuse (1) has been developed, which functions with great reliability at low manufacturing costs. By coating a large area of a printed board with metal, for example, by plating, a well-defined thickness of a metal layer (9) may be achieved in which a fuse (3) has been separated. The well-defined thickness also allows well-defined geometry of the fuse cross-sectional area and fuse length to be achieved and therefore its resistance and interruption characteristics will also be very accurately defined. In case of a temperature rise, the metal layer (9) surrounding the fuse (3) will have a heat dissipating effect on the fuse, implying an essentially reduced risk of board fire. <IMAGE>
申请公布号 NO306036(B1) 申请公布日期 1999.09.06
申请号 NO19940001963 申请日期 1994.05.26
申请人 TELEFONAKTIEBOLAGET L M ERICSSON 发明人 LOEF, STEFAN
分类号 H01H69/02;H01H85/046;H05K1/00;H05K1/02;H05K1/16;(IPC1-7):H01H85/045 主分类号 H01H69/02
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