发明名称 Multi-layered shielded substrate antenna
摘要 A substrate antenna that includes conductive shielding positioned adjacent to and covering at least two, preferably opposing, sides of a conductive trace or antenna structure formed by the trace or traces, supported on a substrate. The conductive enclosure is realized by using a tubular material or planar conductive layers positioned adjacent to the trace. Preferably, shielding layers are disposed on at least two opposing sides of the trace. In one embodiment, a layer of dielectric material is formed over the antenna trace, and one shielding layer is formed on a surface of the substrate opposite that of the trace, and a second shielding layer is formed on the non-conductive material, effectively sandwiching the trace and substrate between them. In further embodiments, a conductive surface is formed between and joining together the two shielding layers, along either one or two sides of the trace or substrate. One method of forming this surface is to apply a planar layer of conductive material extending between and coupled to the first and second conductive shielding layers. Alternatively, a plurality of conductive vias are formed extending through the substrate between and coupled to the first and second conductive shielding layers. A passage is provided through or around an end of the shielding enclosure near a conductive pad to provide appropriate access with a signal feed for the antenna.
申请公布号 AU2772699(A) 申请公布日期 1999.09.06
申请号 AU19990027726 申请日期 1999.02.18
申请人 QUALCOMM INCORPORATED 发明人 ALLEN TRAN
分类号 H05K3/46;H01Q1/24;H01Q1/38;H01Q1/52;H01Q7/04;H01Q13/08;H04Q7/32 主分类号 H05K3/46
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