| 摘要 |
Disclosed is a condenser microphone. The condenser microphone according to the present invention includes: a housing with an opening on a bottom side thereof; a vibration film and a back plate arranged inside the housing to be separated; and a substrate inserted and mounted in the opening and having a mounting unit where an electronic component is mounted and a fixating unit formed around the mounting unit and positioned in an inner part in comparison with the mounting unit. Bending units bent inward are formed on the bottom side of the housing to support the lower side of the fixating unit. According to the present invention, the condenser microphone can be conveniently installed on the main substrate of an electronic device without additionally mounting or forming a conductive member or a conductive layer because the substrate of the microphone protrudes downward. Thus, a decrease in productivity and an increase in manufacturing costs caused by additional processes or additional components can be prevented. In addition, the bending units of the housing support the lower side of the substrate more stably, thus defective products can be remarkably reduced in comparison with an existing condenser microphone. Furthermore, a height of the condenser microphone can be lowered even though a distance between the electronic component and the back plate mounted on the substrate is identical to that of the existing condenser microphone as a central part of the substrate is formed with a shape protruding downward. Accordingly, the condenser microphone with the improved productivity can be mounted in the electronic device slimmer than the existing condenser microphone, thus a usable range can be remarkably increased. |
