发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the coatability of an insulating film.SOLUTION: A method for manufacturing a semiconductor device includes the steps of: forming a first electrode 17 on a semiconductor layer 10; forming a first insulating film 21 including an opening through which a part of the first electrode is exposed on the first electrode; forming a second electrode 26 on the opening and the first insulating film; forming a mask layer covering a side surface of the second electrode and including an opening through which a surface of the second electrode is exposed; forming a third electrode 29 on the second electrode exposed from the mask layer; exposing the side surface of the second electrode by removing the mask layer; and forming a second insulating film 32 covering the second electrode and the third electrode.SELECTED DRAWING: Figure 6B
申请公布号 JP2016143723(A) 申请公布日期 2016.08.08
申请号 JP20150017416 申请日期 2015.01.30
申请人 SUMITOMO ELECTRIC DEVICE INNOVATIONS INC 发明人 KIKUCHI KEN
分类号 H01L21/28;H01L21/283;H01L21/338;H01L29/06;H01L29/778;H01L29/812 主分类号 H01L21/28
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