发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To improve the coatability of an insulating film.SOLUTION: A method for manufacturing a semiconductor device includes the steps of: forming a first electrode 17 on a semiconductor layer 10; forming a first insulating film 21 including an opening through which a part of the first electrode is exposed on the first electrode; forming a second electrode 26 on the opening and the first insulating film; forming a mask layer covering a side surface of the second electrode and including an opening through which a surface of the second electrode is exposed; forming a third electrode 29 on the second electrode exposed from the mask layer; exposing the side surface of the second electrode by removing the mask layer; and forming a second insulating film 32 covering the second electrode and the third electrode.SELECTED DRAWING: Figure 6B |
申请公布号 |
JP2016143723(A) |
申请公布日期 |
2016.08.08 |
申请号 |
JP20150017416 |
申请日期 |
2015.01.30 |
申请人 |
SUMITOMO ELECTRIC DEVICE INNOVATIONS INC |
发明人 |
KIKUCHI KEN |
分类号 |
H01L21/28;H01L21/283;H01L21/338;H01L29/06;H01L29/778;H01L29/812 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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