<p>The height measurement region capable of being detected by a height detection sensor (8) is limited so that only the connection portions are detected and other noise objects are not detected. A luminance image capturing means (3) for obtaining luminance image data of the entire bottom surface of an electronic component (2) and a height image capturing means (8) for obtaining height image data of the entire bottom surface of the electronic component (2) are provided. The positional detection of the electronic component (2) is executed by individually selectively using two-dimensional positional detection by the luminance image capturing means (3) and three-dimensional positional detection by the height image capturing means (8).</p>
申请公布号
WO9944408(A1)
申请公布日期
1999.09.02
申请号
WO1999JP00874
申请日期
1999.02.25
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;MORIMOTO, MASAMICHI;HACHIYA, EIICHI;TANABE, ATSUSHI;NOUDO, AKIRA;SANO, KIMIAKI