发明名称 |
POLISHING APPARATUS |
摘要 |
A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two processing lines extending in parallel from a storage section. Each line is provided with a cleaning unit (18a, 18b) and a polishing unit (10a, 10b), a temporary storage station (20) disposed between the cleaning unit (18a, 18b) and the polishing unit (10a, 10b) and shared by the processing lines. At least two robotic devices (22, 24) are disposed on each of the processing lines for transferring workpieces among the temporary storage station (20), the polishing unit (10a, 10b) and the cleaning unit (18a, 18b). |
申请公布号 |
WO9926763(A3) |
申请公布日期 |
1999.09.02 |
申请号 |
WO1998JP05252 |
申请日期 |
1998.11.20 |
申请人 |
EBARA CORPORATION;KATSUOKA, SEIJI;TSUJIMURA, MANABU;SAKURAI, KUNIHIKO;OSAWA, HIROYUKI |
发明人 |
KATSUOKA, SEIJI;TSUJIMURA, MANABU;SAKURAI, KUNIHIKO;OSAWA, HIROYUKI |
分类号 |
B24B1/00;B24B27/00;B24B37/10;B24B37/11;B24B37/34;B24B49/12;B24B53/007;B24B53/017 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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