| 发明名称 |
DEPOSITION OF COPPER WITH INCREASED ADHESION |
| 摘要 |
A method and apparatus for improving the adhesion of a copper layer to an underlying layer on a wafer. The layer of copper is formed over a layer of material on a wafer and the copper layer impacted with ions to improve its adhesion to the underlying layer.
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| 申请公布号 |
WO9943867(A1) |
申请公布日期 |
1999.09.02 |
| 申请号 |
WO1999US03770 |
申请日期 |
1999.02.19 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
ZHENG, BO;CHEN, LING;MAK, ALFRED;CHANG, MEI |
| 分类号 |
C23C16/02;C23C16/18;H01L21/28;H01L21/285;(IPC1-7):C23C16/56 |
主分类号 |
C23C16/02 |
| 代理机构 |
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代理人 |
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