| 发明名称 |
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent. |
| 申请公布号 |
US2016237303(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201514951045 |
申请日期 |
2015.11.24 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
YUN Geum-Hee;JO Dae-Hui;YOO Seong-Hyun;SOHN Keung-Jin;KIM Jin-Young |
| 分类号 |
C09D163/00;C09D179/08;H05K1/03 |
主分类号 |
C09D163/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for a printed circuit board, the resin composition comprising:
a first resin comprising a polycyclic group; a second resin comprising an imide group conjugated to at least one cyclic group; and a hardening accelerator comprising two or more functional groups, wherein the resin composition does not include a hardening agent. |
| 地址 |
Suwon-si KR |
