发明名称 Socket for integrated circuit chip
摘要 A three point alignment feature facilitates alignment of an integrated circuit chip relative to a socket that is mounted on a printed circuit board. The socket includes four walls that define a rectangle in which the integrated circuit chip is mounted. A first contact point extends inward from a first one of the walls. Second and third contact points extend inward from a second one of the walls, which adjoins the first wall. A first force is applied against the integrated circuit chip from a third one of the walls, which is parallel with the first wall. Second and third forces are applied against the integrated circuit chip from a fourth one of the walls, which is parallel with the second wall. Hence, the integrated circuit chip is aligned in a corner defined by the first and second walls, and is oriented by the three contact points. Spring members may be employed to provide the first, second and third forces. Another alignment feature is employed to facilitate alignment of the socket with respect to the printed circuit board. Further, captive hardware fasteners may be employed to attache the socket to the printed circuit board. <IMAGE>
申请公布号 AU1548799(A) 申请公布日期 1999.09.02
申请号 AU19990015487 申请日期 1999.02.09
申请人 THOMAS & BETTS INTERNATIONAL, INC. 发明人 JONATHAN WAYNE GOODWIN
分类号 H01R33/76;G01R31/26;H01L23/32;H05K7/10 主分类号 H01R33/76
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