| 摘要 |
<p>A printed circuit or wiring board has a substrate 10 with at least one electronic part 4, a solder pad 3 arranged at a predetermined position on the substrate, and at least one solder resist layer 21. The resist layer has a predetermined thickness such that the electronic part 4 is maintained with the distance between an electrode 5 and the solder pad 3 opposite thereto determined by the thickness of the solder resist layer. The electrode of the electronic part then being soldered to the solder pad.</p> |
