发明名称 Encapsulant resin member for semiconductor, and semiconductor element
摘要 Provided is an encapsulant resin for a semiconductor that effectively functions even with a relatively small amount of an additive. The encapsulant resin for a semiconductor is characterized in that the additive has a concentration gradient in the direction of thickness of the encapsulant resin. Specifically, the concentration gradient of the additive is established in the direction of thickness of the encapsulant resin by stacking at least two types of organic polymer resins containing different contents of the additive to form the encapsulant resin or by applying an electric field to the encapsulant resin to effect electrophoresis of the polar additive in the encapsulant resin. <IMAGE>
申请公布号 EP0939441(A2) 申请公布日期 1999.09.01
申请号 EP19990103777 申请日期 1999.02.26
申请人 CANON KABUSHIKI KAISHA 发明人 KISO, SHIGEO;KATAOKA, ICHIRO;YAMADA, SATORU;SHIOTSUKA, HIDENORI;ZENKO, HIDEAKI
分类号 H01L31/04;C08K3/00;C08K5/00;C08L101/00;H01L23/29;H01L23/31;H01L31/02 主分类号 H01L31/04
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