Joining material for electronic components, electronic components and a method for manufacturing the same

摘要

A joining material for an electronic component was disclosed. The component has a plurality of functional layers, each selected from a magnetic layer and dielectric layer and joined with each other. The joining material comprising a glass and a composition of a mol% of ZnO, b mol% of BaO and c mol% of TiO2 (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.