Process for producing semiconductor device package and organopolysiloxane composition used therefor

摘要

A process for producing a semiconductor device package, comprising the steps of putting in a casing a substrate on which a semiconductor device has been mounted, and potting the semiconductor-mounted substrate with an addition-curable organopolysiloxane composition in the casing. The composition shows a Young's modulus of from 1 to 12 kgf/cm<2> after its curing, undergoes less change in the Young's modulus with time and therefore is less causative of stress by strain. Thus, semiconductor device packages can be obtained which may cause no cracking in semiconductor-mounted substrates.