| 摘要 |
In a polishing apparatus, a polishing pad 102 is fixed on top of a circular platen 101. The platen 101 is rotated. A carrier 103 holds either a wafer product or an adjusting wafer. The material of the adjusting wafer is equivalent to the principle component which makes up the surface layer of the wafer product. The carrier 103 is rotated. The carrier 103 is lowered above the rotating platen 101, and a given load is added, thereby polishing the polishing pad 102. A dressing mechanism 106, comprised of a dresser 107, is placed beside the platen 101. The polishing arm 108 is revolvable, so the carrier 103 can be horizontally moved. A loading cup 110 and an unloading cup 111 are both fixed within the path range where the carrier 103 moves. A loader 109 and an unloading unit 112 are both placed near the respective loading cup 110 and unloading cup 111. A cleaning platen 113 is also fixed within the path range where the carrier 103 moves. An adjusting wafer/storage unit 114 is fixed within the path range where the carrier 103 is moved by the rotation of the polishing arm 108. The adjusting wafer 124 is used to adjust the surface of the polishing pad 102. |
