SENSOR DEVICE AND INSPECTION METHOD THEREOF

摘要

Provided is a sensor device capable of a high temperature inspection using self-heating without installing an exclusive terminal and for suppressing a cost increase which involves a chip occupation area increase due to test pad addition. The sensor device has an active logic switch circuit, which switches active logic of an output driver, and is configured to perform a heating inspection while switching the active logic of the output driver during an inspection process by the output driver as a heating source.