IC MODULE, IC CARD, SEALING RESIN FOR IC MODULE, AND METHOD FOR MANUFACTURING IC MODULE

摘要

An IC card (10) comprises a base card (20), and an IC module (11) placed in a recess (21) formed in the base card (20). The IC module (11) comprises a substrate (12), a terminal member (13) formed on one of the surfaces of the substrate (12), and an IC chip (14) attached to the other surface of the substrate (12). The terminal member (13) is connected to the IC chip (14) by wires (15), and the IC chip (14) and the wires (15) are covered with a sealing resin covering (16). The sealing resin covering (16) is formed of a sealing resin containing a resin component and a solid component. The ratio in weight of the resin component to the solid component in a near-surface layer of the sealing resin covering (16) is in the range of 90:10 to 100:0.