SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE AND MOUNTING STRUCTURE

摘要

PURPOSE:To provide an LSI package wherein the reliability on the connection during mounting on a board is high and which is suitable for multipin and high-density mounting. CONSTITUTION:This semiconductor integrated circuit device has such a package structure that the chip 4 is encapsulated in the package body 1 consisting of the rubber-shaped elastic body having a projection 2 at the surface, that one end of the lead wiring 3 made on the surface of the sand package body 1 is connected to the pad 7 of the said chip 4 through the connection hole 5 opened in the said package body 1, and that the other end of the said lead wiring 3 is extended to the apex of the said projection.