| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for roughening the surface of a resin layer, capable of roughening the surface of the resin layer into a rough surface having excellent adhesivity to plated metal layers, etc., and useful for printed circuit boards, etc., by treating the surface of a specific resin layer containing a filler with an organic solvent and subsequently further treating the treated surface of the resin layer with a filler-soluble aqueous solution. SOLUTION: This method for roughening the surface of a resin layer comprises forming (A) a resin layer from a resin composition, bringing the surface of the layer A into contact with an organic solvent such as an aromatic hydrocarbon and subsequently further bringing the treated surface of the layer A into contact with a filler-soluble aqueous solution (for example, an aqueous solution of an acid, alkali or acidic compound) to remove the filler A' from the resin layer A. The resin composition comprises a ring structure-containing polymer [for example, a (hydrogenated) norbornene-based polymer or a (hydrogenated) cyclic conjugated dienic polymer], (A') a filler (for example, a filler comprising calcium carbonate or silica and having an average particle diameter of 0.1-50μm) and, if necessary, further a curing agent.
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