发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To always operate normally an electronic component, such as a semiconductor element by converting generated noise with magnetic powder contained in a magnetic layer into thermal energy and absorbing it immediately before the noise enters into an electronic component such as a mounted semiconductor element mounted, thereby avoiding the entering of noise into an electronic component such as semiconductor element. SOLUTION: This wiring board is conductive to a wired conductor layer 3 on an organic resin insulating layer 2 and is covered and formed with a bonding pad 10 conductive to the wired conductor layer 3, to which electrodes of an electronic component are connected. Then a magnetic layer 11 containing magnetic powder in an organic resin is formed on an outer peripheral end of a bonding pad 10 and/or in the vicinities of the bonding pad 10.
申请公布号 JPH11238992(A) 申请公布日期 1999.08.31
申请号 JP19980038704 申请日期 1998.02.20
申请人 KYOCERA CORP 发明人 YUGAWA HIDETOSHI;YOMO KUNIHIDE
分类号 H05K9/00;H01L21/60;H01L23/12;H05K1/02;H05K1/11;H05K3/34;(IPC1-7):H05K9/00 主分类号 H05K9/00
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