发明名称 WIRE BONDING METHOD AND APPARATUS THEREOF
摘要 PROBLEM TO BE SOLVED: To enable reduction in the movement time of a bonding tool within an allowable range, coinciding with the movement locus with a preset locus, and shortening of a set time for the shape parameter of a wire loop. SOLUTION: A position response x(t) is calculated from a position command X(t) of an X-axis according to an X-axis transfer function Gx and estimated 41. A Z-axis position response z(t) is calculated such that the relationship with the estimated position response x(t) becomes a predetermined locus, and a position command Z(t) for obtaining the position response z(t) is inversely calculated 43 with the use of a Z-axis inverse transfer function G<-1> z). The same procedure is similarly carried out for a Y-axis. These position commands are given to a driver to have it perform wire-loop forming operation.
申请公布号 JPH11238752(A) 申请公布日期 1999.08.31
申请号 JP19980038433 申请日期 1998.02.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIMURA YASUKI;FUNAOKA KOJI;OGA TAKUYA
分类号 H01L21/60 主分类号 H01L21/60
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