| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor that can accurately output an electric signal to applied acceleration, and in which a deflection part is not affected by the thermal stress distortion of an aluminum wiring part. SOLUTION: The deflection part 2 where one end is connected to a weight part 1 so that the deflection part 2 is bent by application of acceleration to the weight part 1, a sensor part being formed at the deflection part 2 so that the acceleration is converted to an electric signal based on the bending of the deflection part 2, a support part 4 for surrounding the outside of the weight part 1 and for supporting the other end of the deflection part 2, and a semiconductor wiring part 5 being connected to the sensor part are formed on a silicon semiconductor substrate F, an aluminum wiring part 6 being formed in a thin film shape on one surface F1 of the silicon semiconductor substrate F is connected to a semiconductor wiring part 5, and is constituted so that thermal stress deformation is generated based on the difference of the thermal coefficients of expansion with the silicon semiconductor substrate F. In this case, the aluminum wiring part 6 is arranged at an interval being larger than a specific one where the deflection part 2 can be insulated from the thermal stress distortion. |
