发明名称 |
Heat pipe arrangement for enhancing the cooling capacity of a laptop computer |
摘要 |
An arrangement for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCS) is enhanced by transferring heat through a flexible heat pipe which is arranged in operative relationship with a novel hinge structure incorporating link elements pivotably interconnecting a display panel with a bottom processor housing so as to impart minimal bending stresses to the flexible heat pipe responsive to pivoting of the display panel, and which facilitates transferring the heat into an area at the rear of the display panel.
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申请公布号 |
US5946187(A) |
申请公布日期 |
1999.08.31 |
申请号 |
US19970935988 |
申请日期 |
1997.09.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CIPOLLA, THOMAS MARIO |
分类号 |
G06F1/20;(IPC1-7):G06F1/20;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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