| 摘要 |
PROBLEM TO BE SOLVED: To obtain a laminated substrate having both low thermal expandability and high heat conductivity used as each heat radiating plate of electronic parts such as a thyristor. SOLUTION: A ceramic substrate 3 for insulation is laminated on the surface of a ceramic-base substrate 1 based on metal copper-contg. silicon carbide by way of a brazing filler metal 2. The ceramic-base substrate 1 preferably contains 10-50 vol.% metal copper and the ceramic substrate 3 for insulation preferably comprises aluminum nitride or alumina. |
