发明名称 HEAT SHIELD BODY
摘要 PROBLEM TO BE SOLVED: To sufficiently cool a heat shield body to a low temperature, reduce the amount of heat intrusion due to radiation heat, and reduce the amount of evaporation of liquid helium. SOLUTION: As a heat transfer medium means of a heat shield body 1, for example, a nonmagnetic helium gas with a large heat conduction rate is airtightly sealed into each channel 5 that is constituted by laminating an edge part 3 and a separation part 4 of a film 2 such as two lamination films made of a nonmagnetic material and a polyester film with a nonmagnetic adhesive or by welding materials. Regarding the outer surface part of the film 2, an aluminum film with a film thickness of several μm is formed by vapor deposition to prevent the helium gas of the sealed heat transfer medium from leaking through a sheet. Although aluminum has improved electrical conductivity, the film thickness is less than 0.1 mm, so that an induction current is small and a magnetic noise is fully small.
申请公布号 JPH11237456(A) 申请公布日期 1999.08.31
申请号 JP19980039989 申请日期 1998.02.23
申请人 HITACHI LTD 发明人 SAHO NORIHIDE;ISOKAMI HISASHI;MORITA MINORU
分类号 G01R33/035;A61B5/05;F25D3/10;H01L39/04 主分类号 G01R33/035
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