| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable reduction of viapad diameter in accordance with fine pitch of a wiring pattern, improve design freedom of a fine wiring pattern, and provide a tape carrier capable of sure bonding to a viapad when the diameter of a metal ball is made as large as possible. SOLUTION: In a tape carrier, a metal wiring 3 is formed on one surface of a tape base member 1, via an adhesive agent layer 2, and a plurality of viaholes 4 where viapads 3b of the metal wiring 3 are exposed are formed on the other surface of the base member 1. The viaholes are formed by punching a tape member 5 in which the adhesive agent layer 2 is formed on one surface of the tape base member 1. The inner wall of the viahole 4 is subjected to coining press from the other surface side of the tape base member 1, and a tapered hole 7 in which the diameter of an aperture part 6 of the viahole 4 is enlarged is formed.</p> |
