| 摘要 |
PROBLEM TO BE SOLVED: To accurately control a low contact force and test height when a semiconductor substrate is sensed. SOLUTION: The device which tests the electric adhesion part of a semiconductor device includes a cantilever arm 14a fitted with a test head 16. The test head 16 is pressed against a base plate 11 by an arm 14a, but it can initially be positioned almost without friction by being separated from a base plate 11 by an air bearing. Sensing means 32 and 34 which sense contacting with the semiconductor substrate are also disclosed. |
