| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module for electric power which rigidly engages a resin case with a ceiling plate. SOLUTION: This semiconductor module for electric power is provided with a metal base 2, semiconductor elements 6a, 6b for electric power which are soldered on the metal base 2, directly or via an insulating plate 4, a resin case 10 connected with an end portion of the metal base 2, sealing agent 14 sealing the semiconductor elements for electric power in a resin case, and a ceiling plate 12 engaged with an upper end portion of the resin case. A first recessed part 10c is formed in the vicinity of the upper end of one frame 10a of the resin case 10, and a second recessed part is formed on the upper end portion of the other frame 10b which faces the one frame 10a and is shorter by the thickness of the ceiling plate 12. A third protruding part 12a engaged with the first recessed part 10c is formed on one end portion of the ceiling plate 12, and a fourth protruding part 12b engaged with the second recessed part 10c is formed on the lower part in the vicinity of the other end portion facing the one end portion of the ceiling plate 12. |
