发明名称 POSITIONING METHOD OF METAL FOIL-CLAD LAMINATE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a high positioning accuracy by a method wherein a positioning is executed by recognizing an unevenness corresponding to the edge face of a prepreg embossed above the surface of a metal foil by piling up the prepregs, the metal foils and flat plates so as to project the metal foils and the flat plates beyond the prepregs sidewards outside at the positioning of metal foil-clad laminates. SOLUTION: A metal foil-clad laminate 1 used for manufacturing a print wiring board is manufactured under heat and pressure by pinching a laminate 10, which is formed by pinching a plurality of bodies 14 fixed by pressure, each of which is formed by piling up a prepreg 12 and metal foils 13, between flat platen 16, between pressing platens 22 and 22 of a molding press 20. In order to position the metal foil-clad laminate 1, a rectilinear optical marker 30 is formed by irradiating a light from a light source 32 so as to recognize an unevenness 2 corresponding to the edge face of a prepreg 12 embossed above the surface of the metal foil 13 of the metal foil-clad laminate. Next, the recognized unevenness 2 corresponding to the edge face of the prepreg is brought so as to fall in line with the optical marker 30 for positioning.</p>
申请公布号 JPH11235803(A) 申请公布日期 1999.08.31
申请号 JP19980040838 申请日期 1998.02.23
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FURUKAWA MITSUO;AOI MASAKAZU
分类号 B32B15/08;B32B37/00;H05K3/02;(IPC1-7):B32B31/00 主分类号 B32B15/08
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