发明名称 MANUFACTURE FOR BARE CHIP AND BARE CHIP CARRIER
摘要 PROBLEM TO BE SOLVED: To properly electrically connect a bare chip while preventing a cost increase. SOLUTION: A bare chip carrier for holding and connecting a bare chip to a tester comprises a base 11 larger than a chip 1, a wiring board 20 having an inner lead 25 connected to a bump 4 and an outer lead 26 and butted to the base 11, a guide ring fixed to the base 11 via the wiring board 20 for positioning the chip 1 and bringing the bump 4 into touch with the inner lead, and a retainer unit 40 for pressing the bare chip 5 from above. Since the chip is positioned by the guide ring according to the bare chip carrier, the bump and inner lead of the wiring board can be correctly registered irrespective of a surface state of the chip and an electric connection is properly secured even at the bare chip of high bump density. Since a positioning recessed part is eliminated from the wiring board, a cost increase and productivity deterioration can be prevented.
申请公布号 JPH11237435(A) 申请公布日期 1999.08.31
申请号 JP19980057478 申请日期 1998.02.23
申请人 HITACHI LTD 发明人 SUMI YOSHIYUKI;HARADA SHOICHIRO;YOSHIDA IKUO;MIYAMOTO SEIJI;HAYASHIDA TETSUYA
分类号 G01R31/26;H01L23/32 主分类号 G01R31/26
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