| 摘要 |
PURPOSE:To use a normal multipin lead frame, to eliminate the generation of a crack in a package, which is caused by the warpage of the lead frame, and to obtain the lead frame, which is little subjected to contamination due to out-gassing, by a method wherein the plane part of each conductive plate is laterally crossed over an insulating layer laminated on the lead frame and the terminal parts of the conductive plate are connected and fixed to each inner lead. CONSTITUTION:In a multilayer lead frame with an insulating layer 4 and conductive plates 2, which are laminated on the lead frame 1 in the order of the layer 4 and the plates 2, each conductive plate 2 has a plane part 2a and a prescribed number of terminal parts 2a, which are made to project from the plane part 2a, the plane part 2a is laterally crossed over the layer 4 laminated on the lead frame 1 and at the same time, at least one of the terminal parts 2b is connected and fixed to one of inner leads 1a of the lead frame 1. For example, each tape 4 for taping use, which is constituted of a base material 4a and a bonding agent layer 4b, is previously adhered on each inner lead 1a of a lead frame 1 in a rectangular form and a prescribed number of power plates 2, which are independent from each other, are respectively provided on each inner lead 1a in such a way as to lie across on each tape 4 for taping use. |
