| 摘要 |
The card (1) is in the form of a board and is provided with several dynamic random-access memory chips (2), internal connection points (7), and external connections (3). The DRAM chips are arranged in rows and mounted on the internal connection points. Conductive tracks leading to the external connections can be linked selectively to the DRAM chips using separable connectors or alternatively through one or more additional integrated circuits (4). Input and output signals between the internal and external connections are influenced by the opening or closure of the separable links. The operation of the additional circuits, e.g. drivers, are dependent on the state of the separable elements. The additional circuits may also be error detection and correction logic, cache memories or refresh circuits. <IMAGE> |
