Method for manufacturing electronic parts and apparatus for manufacturing thin films

摘要

In a method for manufacturing electronic parts by laminating metal thin films (1) and insulating thin films (2) on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve. <IMAGE>