Shaping polishing pad to control material removal rate selectively

摘要

An end effector to facilitate conditioning of a surface of a polishing pad used in chemical-mechanical polishing of an substrate surface is described. The end effector includes a rigid body including a contact surface capable of being attached to a conditioning disk and having a predetermined non-planar region that is adapted to at least one of (i) effectively maintain a non-planar area on the surface of the polishing pad and (ii) shape the polishing pad, when the end effector is employed to condition the polishing pad.