| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive paste composition improved in peel strength to a lead frame, especially, a copper lead frame and having such low stress as to prevent the formation of chip cracking or chip warpage and not suffering from reflow crack even when used for a copper lead frame and a semiconductor device prepared by using the same. SOLUTION: There are provided an adhesive paste composition comprising (A) a reaction product obtained by reacting a maleic anhydride/polybutadiene adduct with an acrylic or methacrylic ester compound having hydroxyl groups in the molecule, (B) a reactive diluent, (C) a radical initiator, and (D) a filler and a semiconductor device prepared by bonding a semiconductor element to a support member with the paste composition and sealing the assemblage.</p> |
