Bumped semiconductor device having a trench for stress relief

摘要

A bumped semiconductor device including bond pad (12) formed on a semiconductor die (10), and a passivation layer (14) overlying the semiconductor die and a portion of the bond pad (12). A solder bump (22) is formed so as to overlie the bond pad (12), and a stress isolation trench (15) is formed in the passivation layer (14), so as to surround the solder bump (22).