ELECTROPLATING DEVICE AND ELECTROPLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a high-productivity electroplating device and a electroplating method by which the rear surface is hardly contaminated. SOLUTION: This device is provided with a plating tank 4 capable of being filled with a plating soln. M, a plating jig 1 for attachably/detachably holding the both of plates P to be plated in the state that these surfaces of a pair of the plates P to be plated are directed outward and the rear surfaces are opposed to each other in parallel at an interval and an anode 3 connectable to the anode of a power source 6 and arranged oppositely to the respective surfaces of the respective plates P to be plated. The plating jig 1 is furnished with a couple of frames 10 arranged in parallel with each other at an interval and a guide 12 for attachably/detachably fixing the plate P to be plated respectively to these frames 10.