| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing device having high reliability by improving the adhesion between a preplating frame of, particularly Pd/Pd-Au or the like, and to obtain a resin composition to increase the reflow resistance of the semiconductor sealing device and preventing the deterioration of moisture resistance after reflow. SOLUTION: A sealing resin composition comprises (A) an epoxy resin, (B) a novolak type phenolic resin, (C) diethyldithio-carbamate zinc, and (D) an inorganic filler as the essential components, the amount of the diethyldithiocarbamate zinc (C) being 0.01-1.0 wt.%, and also, that of the inorganic filler (D) being 25-95 wt.%, each based on the resin composition. Further, the semiconductor chips in the semiconductor device are sealed by the cured product of this composition. |
