| 摘要 |
PCT No. PCT/JP94/02300 Sec. 371 Date Oct. 10, 1995 Sec. 102(e) Date Oct. 10, 1995 PCT Filed Dec. 28, 1994 PCT Pub. No. WO95/18708 PCT Pub. Date Jul. 13, 1995A resin compound for a molding die, a molding die made of the resin compound, and a molding method using the molding die are disclosed. The resin compound includes thermoplastic resin, inorganic fiber reinforcing material and inorganic particle filler, has a flexural strength of 1000 kgf/cm2 or more and a modulus of elasticity in bending of 70000 kgf/cm2 or more, and allows machining. A deflection temperature under flexural load of the compound may be 180 DEG C. or more. From this compound, it is possible to provide a core, a cavity block or the like of molding dies which can be accurately finished by machining finishing with a low cost and within a short term, have durability and allows recycling. The molding dies can be applied to various molding methods, and provide accurate molded products with a low cost.
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