| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition with high storage stability, curable at low temperatures, capable of giving cured products with excellent heat resistance and, in particular, high resistance to tin plating solution, and useful for e.g. protective films with electrical insulation, by homogeneously dissolving a siloxane-modified polyimide-based resin and an epoxy resin, together with a benzotriazole compound, in an organic solvent. SOLUTION: This composition is obtained by dissolving (A) 100 pts.wt. of a siloxane-modified polyimide-based resin prepared by polycondensation among (i) an aromatic tetracarboxylic acid dianhydride, (ii) siloxanediamine, and (iii) another aromatic diamine component, (B) 1-50 pts.wt. of an epoxy resin and (C) 0.1-10 pts.wt. of a benzotriazole compound of the formula (X is OH, carboxyl or H; R1 to R3 are each a hydrocarbon) in an organic solvent, wherein, as the component A, it is preferable to use a siloxane-modified polyimide-amic acid resin which has imide moiety formed by polycondensation between the component (i) and the component (ii) and amic acid moiety formed by polyaddition between the component (i) and the component (iii). |
