| 摘要 |
PROBLEM TO BE SOLVED: To attain improvement of polishing uniformity in a workpiece of wafer or the like, increase a margin of a wear amount of a retainer ring, and attain improvement of a rate of operation of a CMP device. SOLUTION: A carrier 1 is constituted by a housing 10, carrier base 11, retainer ring 12, seat supporter 13, hard seat 18, and a soft backing seat 19, the seat supporter 13 is formed by a supporter main unit part 14 having a ventilation port 14a communicating with an air inlet/outlet 11b of the carrier base 11, diaphragm 15 having flexibility, and an edge ring 16. In this way, a wafer W is pressed uniformly by pressure of air in a pressure chamber R. A change of press pressure in a peripheral edge part of the wafer W generated by wearing of the retainer ring 12 is relieved by the diaphragm 15. |
