发明名称 Cooling device for central processing unit module
摘要 A cooling device for a CPU module includes an attachment plate fixed to the module and in contact with a CPU in the module. The attachment plate defines an elongate hole. A spring plate has two arms. A heat sink has a number of heat dissipating fins projecting from a base plate, wherein a portion of the fins have engaging teeth formed at free ends thereof. A mounting rod has a cross-slotted head and a tail formed with a locking tongue. A fan mounting plate is formed with two engaging teeth. A fan is screwed to the fan mounting plate. To assemble the cooling device, the locking tongue is extended through the spring, the heat sink and the elongate hole of the attachment plate and then rotated 90 degrees to engage an inner face of the attachment plate where the two arms of the spring are pressed to push the rod away from the heat sink whereby the heat sink and the attachment plate are fixedly connected. The mounting plate is then pressed onto the heat sink to cause the engaging teeth of the mounting plate to fixedly engage with the engaging teeth of the corresponding heat dissipating fins of the heat sink.
申请公布号 US5943210(A) 申请公布日期 1999.08.24
申请号 US19980084463 申请日期 1998.05.26
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 LEE, KEN;LEE, RICHARD;CHEN, STANLEY
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
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